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Solving 'leaks' in welded joints for the semiconductor industry through integrated casting.

Put an end to leaks and quality variations at welding points. Dramatically improve yield and reliability through the "integration" of castings.

Are you experiencing a decrease in yield due to "leaks" from welds in the cooling pipes and exhaust system components of semiconductor manufacturing equipment? Methods that connect multiple parts always carry the risk of poor bonding. ■Essential Causes of Leakage Issues - Number of joints: Multiple joints in thick plates, pipes, bars, etc., induce variations in quality. - Thermal distortion: Minute deformations caused by heat during bonding reduce the precision of sealing surfaces and threaded areas. - Increased inspection labor: Comprehensive inspection of all leakage risk areas becomes unavoidable, leading to prolonged lead times. ■Solution: Integrated Forming through Casting The Hinode Group proposes "integration" by unifying multiple parts into one through casting. - Quality improvement: By eliminating joints, the risk of leaks is physically resolved. - Cost reduction: Reducing welding assembly and multiple machining processes lowers total costs. - High precision: Thin-walled structures of 1.5mm and complex flow path shapes can be reproduced with high precision using the material itself. Prototyping with 3D printed sand molds can be done in as little as 5 days. If you are struggling with leakage issues, why not reconsider the method itself to "integrated casting"?

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